| KEY SPECIFICATIONS | |
|---|---|
| Control Function | DCU/UDP |
| Monitoring Function | 1,Chip-level: status of power chip(gate voltage, drain current, case-temp); |
| Protection Functions | 1,Over TEM:≥+55℃ shutdown |
| Product Revision | A |
| RF SPECIFICATIONS | |
|---|---|
| AC Voltage | 380 VAC typ. , 420 VAC max. |
| ESD sensitivity(HBm) | Class 0, passed 150V |
| Gain flatness | ± 1.5 dB typ |
| Harmonics@Pout=57dBm | -10 dBc max |
| Impedance | 50 Ohms |
| input frequency band 1 | 2.5-7.5 GHz |
| Input VSWR | 1.5 :1 max |
| output Psat min | 57 dBm |
| Power gain min | 57 dB |
| RF input power | +5 dBm |
| Spurious@Pout=57dBm | -60 dBc max. |
| ELECTRICAL SPECIFICATIONS | |
|---|---|
| power consumption | 500W typ |
| INTERFACE SPECIFICATIONS | |
|---|---|
| Communication Connector | RJ45 |
| Forward / Reverse Coupling | N Female/ N Female |
| Input/ output connector | N Female/WRD250D30 |
| ENVIRONMENTAL SPECIFICATIONS | |
|---|---|
| altitude | 10,000 feet |
| relative humidity | 95% |
| shock(non operating) | 20G for 11msc half sine wave, 3 axis both directions |
| shock/vibration(MIL-STD-810F) | 25g rms (15 degree 2KHz) endurance, 1 hour per axis |
| temperature operational | -20°C to +50°C |
| temperature storage | -50°C to +70°C |
| PHYSICAL SPECIFICATIONS | |
|---|---|
| cooling | Built in Cooling system, forced air cooling |
| product weight | 200 kg max |
| size | 19 Inch 20U*500 mm |

